NationGate is equipped with the state of the art and latest surface mount devices machines and equipment. These Equipment are able to place the smallest dimension of chip size at 01005 Placement speed and capacity is rated at CPH of 20,000 chips per hour. Fully automated lines with these machines lined in array to maximize the throughput and efficiency.

Overall equipment efficiency (OEE) is measured in real time and analysed by machine specialist. Predictive machine and preventive equipment maintenance is carried out before there is a stoppage occurrence. Parameters and statistical control and data are also collected and monitored on real time basis.

NationGate specialized in high volume assembly of all types of products. Mainly fibre optic modules, Electronic boards and final products. It offers its clients high volume and high mixed production line capabilities. Quick change over of production lines to different products and models. Software and test parameters are down loaded from storage servers and each modular machines load the new programs “on the fly”. Product characteristics are kept and stored for future reference.

This Big Data are analysed by a team of Engineers in order to enhance product reliability and yield rates. Most process steps are predefined enabling the quick and easy routine important for consistent quality.

In addition to quality and process stability will determine high yields and reduction of scrap costs and over production.

The assembly lines in NationGate has been set up with automated and semi automated machines for example Auto soldering stations, Auto screw stations and Auto glue dispensing stations. Such automation are utilized to ensure consistency in quality and process. These lines and machines allow the company to operate on a higher and longer work schedules and platforms of 24/7 type of production.

NationGate has the process and capability to perform Semi con process like Die attachment, Wire Bonding and semi con testing.

Mainly we serve our customers who require COB (Chip On Board) process where a semiconductor component is placed on PCB or Flex circuit and connections are performed using a wire bonding machine. The conductive wire can either be gold or aluminum Material.

NationGate has a high-end laboratory center with equipment such as: Xray machines, EDX, XRF, Nano Metallographic, SEM (Scanning Electronic Microscope), Temperature Cycling Chambers, Drop Test, Moisture Analyzer, Spectrometer, MFI Measuring Machine, Paper Abrasion Wear tester.

With these analytical machines in its premise, reliability and complex testing can be carried out. NationGate able to provide better service to its customers.

Ball Grid Array (BGA) are semicon products that are very expensive. As the individual connector ball can be repaired and replaced, NationGate do offer this reballing service to our customers. By repairing such components, overall costs are reduced and scrap costs are kept to a minimal. This is beneficial to our customers and clients as they can remain competitive.

The reballing process of a BGA device is highly complicated and require specialist and highly trained personnel to perform such a fit. In addition, NationGate utilizes certain equipment for this process in order to guarantee consistency, good products and reliability.

MES (Manufacturing Execution System) has been installed plant wide in NationGate. This coverage from Incoming of materials until shipping department.

Every critical parameters and data are captured as Big Data in our MES and processed as usable data for our inhouse specialist and engineers in the Continuous Improvement Program (CIP) These improvements are implemented plant wide by the various CIP teams.