Capabilities
From high-precision SMT processes and advanced assembly lines to sophisticated semiconductor manufacturing and integrated smart production, our capabilities ensure top-tier quality and efficiency. Our state-of-the-art facilities and industrial 4.0 solutions provide the driving force toward innovation and excellence, empowering our customers to always be one step ahead in a competitive market environment.
High Precision SMT Process
Cutting-Edge Surface Mount Technology
NationGate is equipped with the state of the art and latest surface mount devices machines and equipment. These Equipment are able to place the smallest dimension of chip size at 01005 Placement speed and capacity is rated at CPH of 20,000 chips per hour. Fully automated lines with these machines lined in array to maximize the throughput and efficiency.
Overall equipment efficiency (OEE) is measured in real time and analysed by machine specialist. Predictive machine and preventive equipment maintenance is carried out before there is a stoppage occurrence. Parameters and statistical control and data are also collected and monitored on real time basis.
High Level Assembly Line
Production with Next-Gen Automation
NationGate specialized in high volume assembly of all types of products. Mainly fibre optic modules, Electronic boards and final products. It offers its clients high volume and high mixed production line capabilities. Quick change over of production lines to different products and models. Software and test parameters are down loaded from storage servers and each modular machines load the new programs “on the fly”. Product characteristics are kept and stored for future reference.
This Big Data are analysed by a team of Engineers in order to enhance product reliability and yield rates. Most process steps are predefined enabling the quick and easy routine important for consistent quality. In addition to quality and process stability will determine high yields and reduction of scrap costs and over production.
Assembly Lines with 24/7 Capabilities
The assembly lines in NationGate has been set up with automated and semi automated machines for example Auto soldering stations, Auto screw stations and Auto glue dispensing stations. Such automation are utilized to ensure consistency in quality and process. These lines and machines allow the company to operate on a higher and longer work schedules and platforms of 24/7 type of production.
Low Pressure Molding
Precision Protection with Electronics
High Precision Low Pressure Molding is a specialized manufacturing process used by NationGate to encapsulate electronic components with precision and accuracy. This process involves applying thermoplastic materials at low pressure to protect sensitive components from environmental factors such as moisture, dust, and vibration. By using precise molds and controlled pressure, NationGate ensures that the molding material is applied uniformly, resulting in a high-quality, reliable seal. This technique is particularly useful for electronic products that require protection without compromising their functionality or design.
Semiconductor Process
Chip-on-Board (COB) Solutions
NationGate has the process and capability to perform Semicon process like Die attachment, Wire Bonding and semicon testing.
Mainly we serve our customers who require COB (Chip On Board) process where a semiconductor component is placed on PCB or Flex circuit and connections are performed using a wire bonding machine. The conductive wire can either be gold or aluminium Material.