Key Features
Performance Architecture
- Based on Intel® Xeon® 6th Scalable Processors, up to 350W TDP
- 32 DIMM slots support RDIMM up to 6400MT/s , MRDIMMs up to 8000MT/s
- Support NVIDIA HGX B200 air cooling
Flexible Configuration
- CPU to Switch flexible link band width (X16 or X32)
- Support full high and half high NIC card
For New Data Center
- Support front IO access
- N+N PSU Redundant
- High-efficiency thermal solution for power save
- High-efficiency DC/DC solution
Technical Specifications
CPU | 2 x Intel ® Xeon 6700E/6500P/6700P Processor up to 350W |
GPU | 8 x HGX B200 air cooling |
Memory | Up to 32 DDR5 DIMM Slot, support RDIMM up to 6400MT/s , MRDIMMs up to 8000MT/s |
Storage |
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PCIE Extension |
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Enclosure Management |
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Front IO |
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Cooling |
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Operation Temperature | 5ºC – 35ºC |
PSU |
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Dimension | 440mm(H) x 448mm(W) x 900mm(D) |